Introduction to Semiconductor-Related Equipment Development: Vacuum Lamination Equipment
A compact tabletop device that takes up little space! No bubbles will form between the wafer and the film.
The "Vacuum Adhesion Device" is a product that adheres without air bubbles between the wafer and the film by creating a vacuum inside the device. It is a compact tabletop device that does not take up much space and does not require a skilled operator. Additionally, it can be customized according to customer requests. 【Features】 ■ Tape adhesion without air bubbles between the wafer and the film ■ Adhesion method using a vacuum inside the device ■ Compact tabletop device that does not take up much space ■ No skilled operator required ■ Compatible with UV-curable film tape ■ Supports various films by changing the adhesion unit *For more details, please refer to the PDF document or feel free to contact us.
- Company：都波岐精工 本社・工場
- Price：Other
